Power unit assembly demonstration
We envision a fully Robot assembly uses Yamaha Motor’s SCARA robot “YK510XE” and linear conveyor “LCMR200” to centralize the process from mounting to assembly of power module units for in-vehicle inverters.
The process of removing the dust-prevention “caps,” which is a challenge in automating circuit board assembly, can also be handled quickly, making this a demonstration that is close to a mass production process.
The leads of the power semiconductor are Mating in the Z-Move structure Socket 18021S mounted on the gate substrate to accommodate vibration resonance.
In addition, the connectors mounted between the boards are the 10120 series with Z-Move structure and the 10109 series with Floating structure mounted on the same board, allowing them to be Mating even when used in large numbers, which is an advantage of Floating structure.
We have achieved Robot assembly using general-purpose SCARA robots and linear conveyors that absorb mounting misalinment and assembly position deviations.
The process of removing the dust-prevention “caps,” which is a challenge in automating circuit board assembly, can also be handled quickly, making this a demonstration that is close to a mass production process.
The leads of the power semiconductor are Mating in the Z-Move structure Socket 18021S mounted on the gate substrate to accommodate vibration resonance.
In addition, the connectors mounted between the boards are the 10120 series with Z-Move structure and the 10109 series with Floating structure mounted on the same board, allowing them to be Mating even when used in large numbers, which is an advantage of Floating structure.
We have achieved Robot assembly using general-purpose SCARA robots and linear conveyors that absorb mounting misalinment and assembly position deviations.
Demonstration video
Name: 38th Internepcon Japan
Date: Wednesday, January 24th – Friday, January 26th, 2024
Host country: Japan
Name: 2024 Automotive Technology Exposition Yokohama/Nagoya
Dates: Yokohama: May 22nd (Wed) – 24th (Fri), 2024 Nagoya: July 17th (Wed) – 19th (Fri), 2024
Host country: Japan
Exhibited products
10120 series
2.0mm pitch, Z Floating (Z-Move structure) Floating structure type Stacking connection (ST/ST) Board to Board Connector connector for in-device connections intended for use in harsh vibration environments. Floating (Floating structure) construction with 0.65mm X Y direction to Floating. 0.02mm resonance amplitude and 0.8mm effective Mating length in the Z direction. Employs a two-point contact for reliable removal of foreign matter even in tough environments. 125°C compatible product for use in high-temperature environments. IRISO Adoption of proprietary Floating structure technology “Z-Move structure ® (Zee Move)” (trademark registered). This connector has excellent vibration resistance and shock resistance, preventing contact misalignment due to vibration resonance and shock by Floating moving in the Z direction while the contacts remain fixed. IRISO We will provide you with a fixing method adapted to your equipment Simulation using our unique analysis system.
10109 series
0.635mm pitch, Floating structure type Stacking connection (ST/ST) Board to Board Connector connector for high-speed transmission of digital signals. Floating (Floating structure) structure with 0.5mm X Y direction to 0.5mm Floating effective Mating length in Z direction. 3.0Gbps (typical reference value based on in-house definition) for high-speed transmission. Impedance matching: Differential 100 Ω. Various Mating 2-point contact for reliable foreign object removal even in tough environments with high
18021S series
A pin header Socket (pitch: 2.54mm, 0.64mm square) with Floating structure (Floating Mating part). It uses a bottom Mating method that is ideal for board stacking, and by replacing the conventional hand soldering board connection with the connector, it eliminates the delicate soldering process and improves connection reliability.